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用透射电子显微镜 (TEM)和x射线衍射 (XRD)方法对经 30 0℃ ,2h退火的Ag和Cu自由膜和Si基体上的Ag和Cu附着膜的异常晶粒生长和织构变化进行了实验研究 .XRD分析表明 :Ag和Cu沉积膜均有 (111)和 (10 0 )择优取向 .但经退火处理后 ,Ag和Cu自由膜的 (111)织构稍有加强 .相反 ,Si基体上的Ag和Cu附着膜的 (10 0 )和 (110 )织构明显加强 ,同时用TEM在Cu附着膜中观察到了两个 (110 )和四个 (2 11)取向的异常大晶粒 .根据表面能和应变能的各向异性对实验结果进行了分析 .
The abnormal grain growth and texture changes of Ag and Cu films on Ag and Cu free films and Si substrates annealed at 300 ℃ and 2h were investigated by transmission electron microscopy (TEM) and X-ray diffraction (XRD) The results of XRD analysis show that both (111) and (100) preferred orientation exist in Ag and Cu films, but the (111) texture of Ag and Cu free films is slightly strengthened after annealing treatment. The (10 0) and (110) textures of the Ag and Cu attached films were significantly strengthened, while two (110) and four (2 11) oriented abnormally large grains were observed in the Cu attachment film by TEM. The experimental results were analyzed based on the anisotropy of surface energy and strain energy.