从工艺过程和结构设计两个方面对LTCC(低温共烧陶瓷)基板腔底平整度进行了定量研究。结果显示,在10~30μm内,填充物与腔体的配合尺寸对腔底平整度影响不大,腔底的翘曲主要是由于通孔分布密度过大所造成的。对于直径为0.15 mm的金属化通孔,孔心间距需达到0.42 mm时才能够获得较好的腔底平整度。 The cavity flatness of LTCC (Low Temperature Co-fired Ceramic) substrate was studied quantitatively from the aspects of process and structure design. The results show that in the range of 10 ~ 30μm, the fitting size of the filler and the cavity has little effect on the flatness of the cavity bottom. The warp of the cavity bottom is mainly caused by the excessive density of the through holes. For 0.15 mm diameter metalized through holes, a good cavity flatness can be achieved with a hole pitch of 0.42 mm.