ＡｍｋｏｒＴｅｃｈｎｏｌｏｇｙ公司的ＭｉｃｒｏＬｅａｄＦｒａｍｅ封装用独特的技术处理ＲＦ及散热问题 ,再加上精密的引脚和低成本生产条件 ,自然成为业界焦点。一般生产测试过程中 ,生产商面对的最大难题是要在控制测试成本之余 ,仍以最快速度对高产量的小型表面封装进行 AmkorTechnology’s MicroLeadFrame package addresses RF and thermal issues with unique technologies that, of course, have been the focus of the industry with sophisticated pin-count and low-cost manufacturing conditions. In the process of general production testing, the biggest challenge for manufacturers is to control the test cost while still maintaining the fastest speed for high-volume small surface mount packages