目前,电子封装的小型化已引领高端市场的发展一段时间,而我们仍然发现,市场还在朝着更小巧、功能更强的方向前进,集成封装也在2011年取得重大进步。将更多的内存封装到越来越小的元器件中去,这一变化带动了堆叠芯片 Currently, the miniaturization of electronic packaging has led the development of the high-end market for some time, and we still find that the market is still moving in a smaller and more powerful direction. The integrated package also made significant strides in 2011. Packaging more memory into smaller and smaller components, this change led to the stack of chips