论文部分内容阅读
引言当今红外器件技术的发展趋势是使传感器这一级兼有更多的功能。最好是可以更直接地把放大、开关、信号处理、光谱滤波和外加传感器所有这些都合并到传感器这一级上。为了达到这种组合,半导体工业为复杂的集成电路所研制的加工技术已应用于红外元件设计方面。目前,在达到红外器件大规模集成这个最终目标方面已有相当进展。最后,预期可以得到一预封装的、完整的器件,它包含有探测器阵列、冷却、滤波、信号处理和其他作用,而所有这些全都合并在一个曾一度只能装一个探测器的封壳内。
INTRODUCTION The trend of today's infrared device technology is to have more functions at the sensor level. It is best to incorporate amplification, switching, signal processing, spectral filtering, and additional sensors more directly onto the sensor level. In order to achieve this combination, the processing technology developed by the semiconductor industry for complex integrated circuits has been applied to the design of infrared components. At present, considerable progress has been made towards the ultimate goal of large-scale integration of infrared devices. Finally, it is expected that a pre-packaged, complete device will be obtained that includes a detector array, cooling, filtering, signal processing, and other functions, all of which are combined in a package that once could hold only one detector .