据《中国电子报》2010年1月5日报道,为加快国家科技重大专项“极大规模集成电路制造装备及成套工艺”的组织实施,探索创新机制,引导产业发展,“中国集成电路封测产业链技术创新联盟”2009年12月30日在北京成立。这是16个国家科技重大专项中成立的首个产业技术创新联盟。据介绍, According to “China Electronics News” January 5, 2010 reported that in order to speed up the national science and technology major project “very large-scale integrated circuit manufacturing equipment and complete sets of technology” organization and implementation, to explore innovative mechanisms to guide the development of the industry, “China IC packaging and testing Industry Chain Technology Innovation Alliance ”was established in Beijing on December 30, 2009. This is the first industrial technology innovation alliance established in 16 major national science and technology projects. According to reports,