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如何提高大功率LED的散热能力,是LED器件封装和器件应用设计要解决的核心问题。介绍并分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势与前景用途
How to improve the heat dissipation ability of high-power LED is the core issue to be solved in the design of LED device package and device application. Introduced and analyzed the domestic and international high-power LED thermal packaging technology research status, summed up its development trend and prospects of use