论文部分内容阅读
Pfizer的技术人员研制了一种用粉末冶金法制备的铜镍锡亚稳态合金,其可用于微电子技术的插座、插头和弹簧等联接元件。研制的TMC72900合金通过亚稳解离过程而具有良好的塑性。正如其它时效硬化合金一样,这种亚稳合金在其硬化时解离为化学组分不同的两相。亚稳离解的发生是一种特
Pfizer’s technicians have developed a copper-nickel-tin metastable alloy prepared by powder metallurgy, which can be used in microelectronic technology such as sockets, plugs and springs. TMC72900 alloy developed by metastable dissociation process has good plasticity. Like other age hardened alloys, this metastable alloy dissociates into two phases of different chemical composition when it is hardened. Metastable dissociation occurs is a special