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由于无线通讯系统的广泛应用,使得低成本、高性能的印制线路板的需求量大幅增加。在许多应用中,都要求材料具有很低的损耗因子(<0.002),严格的介电常数控制和优异的热稳定性。陶瓷充填的PTFE(聚四氟乙烯)印制板可以提供这些性能,但成本昂贵,难以用于高产量的商用电子品。这一情况最近已有所转变。这是因为自动化的生产工艺的发展使制造大量陶瓷充填的PTFE基材的生产成本大大降低。 由于PTFE基材的印制板制造采用新开发的工艺,其制造成本也随之下降。传统上使用的镀前活化处理的化学溶液对环境有害,价格昂贵,现正逐渐被低成本的等离子体工艺所取代。 本文旨在通过Rogers Corporation和Advanced Plasma System Inc.共同努力开发的陶瓷充填的PTFE材质的印制板的等离子体活化工艺。本文给出了含有混合介电材料(陶瓷充填PTFE和FR4)的双面及多层印制板工艺甑别实验结果。
Due to the widespread use of wireless communication systems, the demand for low-cost, high-performance printed circuit boards has increased dramatically. In many applications, materials require a very low loss factor (<0.002), tight dielectric constant control, and excellent thermal stability. Ceramic-filled PTFE (polytetrafluoroethylene) printed boards can provide these properties, but are expensive and difficult to use in high volumes of commercial electronics. This situation has recently changed. This is because the development of automated production processes has greatly reduced the production costs for manufacturing large volumes of ceramic-filled PTFE substrates. As the PTFE substrate PCB manufacturing using the newly developed technology, its manufacturing costs also will decline. Traditionally, pre-plating chemical treatments are environmentally harmful and expensive, and are now being replaced by low-cost plasma processes. This article is a plasma activation process for ceramic-filled PTFE-based printed boards jointly developed by Rogers Corporation and Advanced Plasma System Inc. In this paper, the experimental results of double-sided and multi-layer PCBs with mixed dielectric materials (ceramic filled PTFE and FR4) are given.