The planarization mechanism of alkaline copper slurry is studied in the chemical mechanical polishing (CMP) process from......

Beyond 45 nm, due to the superior CMP performance requirements with the metal gate of aluminum in the advanced CMOS proc......

The extraction of scandium from one certain deposit was studied by the liquid membrane emulsion technique using P507-Spa......

A series of Eu(Ⅲ) complexes of α-thenoyltrifluoroacetone(HTTA) with trioctylphosphine oxide(TPPO) and benzoic acid(BA)......

为探究吕家坨井田地质构造格局,根据钻孔勘探资料,采用分形理论和趋势面分析方法,研究了井田7......