薄膜混合电路与厚膜混合电路相比,具有电路元件精度高、稳定性好、集成度高等优点。但其造价高、多层布线困难,因此,在市场竞争中前者不如后者。 为了获得成本低、稳定性好的薄膜电路,国内外有关工作者进行了大量工作。近年来,我们结合微波集成电路的生产进行了尝试,证明真空蒸发NiCr合金薄膜作电阻、蒸发FeCu薄膜作导带是行之有效的。 Film hybrid circuits and thick film hybrid circuit compared with the circuit components with high precision, good stability, high integration advantages. However, its high cost, multi-layer wiring difficulties, therefore, the former in the market competition as the latter. In order to obtain low cost, good stability of the thin film circuit, the relevant domestic and foreign workers carried out a lot of work. In recent years, we have tried with the microwave integrated circuit production to prove that the vacuum evaporation of NiCr alloy film for resistance, evaporation of FeCu film as the conduction band is effective.