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我讲三个问题: 一、四年来电子元器件引线可焊性技术攻关工作的回顾电子元器件引线可焊性问题是在1980年钱敏部长根据薄一波副总理关于“把元器件搞上去是电子工业能否翻身的一个重点”的指示精神,在电子工业领导干部会议上提出来的。钱部长当时指出:引线可焊性问题与整机关系很大、影响很广,包括影响元器件的出口,部要组织有关单位限期解决这个问题。科技司根据部党组指示精神于81年5月在南京召开电子元器件引线可焊性技术会议,动员各省市有关单位组织技术攻关。南京会议使许多同志认识到,要把元器件搞上去,提高元器件可焊性是重要一环;早日解决这个长期以来的多见病、常发病的老大难向题是十分必要的。因此,江苏、上
I talk about three issues: one or four years of electronic components lead solderability of technical research work review Electronic components lead solderability problems in 1980, according to Minister Qian Qian Deputy Prime Minister Bo Yibo “to engage the components Is the electronic industry can turn over a key ”spirit of the instructions, put forward by the leading cadres in the electronics industry. Minister of Money pointed out at the time: Lead soldering problems have a great relationship with the whole machine and have a wide range of impacts, including affecting the export of components and parts. Organizations must organize relevant units to solve the problem within a specified time limit. Science and Technology Division in accordance with the instructions of the Ministry of Party Group held in May 81 in Nanjing in solderable electronic components lead technology conference to mobilize the relevant units in various provinces and cities to organize technical research. Nanjing Conference made many comrades realize that engaging components and improving solderability of components and parts is an important part. It is very necessary to solve this longstanding and common problem as soon as possible. Therefore, Jiangsu, on