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笔者在刚刚于西班牙巴塞罗那结束的国际固态传感器大会Transducers 2013上担任了压力传感器Session的主席,对现场七个口头报告有了最直接的接触,据此可以体会到MEMS压力传感器技术对全球最新进展,于下面顺序介绍。台湾的Asia Pacific Microsystems公司与台湾清华大学合作研发了汽车TPMS传感器(论文题目:NOVEL TPMS SENSING CHIP WITH PRESSURE SENSOR EMBEDDED IN ACCELEROMETER)。如图1所示,为了减小芯片尺寸,将压力传感器部分制作在压阻加速度传感器的质量块中。采用CavitySOI工艺并结合硅/玻璃键合,该复合集成传感器显示了如表1所示的性能指标。
I was the chairman of Pressure Sensor Session at Transducers 2013 at the International Solid-State Sensor Conference just concluded in Barcelona, Spain. I had the most direct contact with the seven oral presentations on the site, and I was able to see the latest global developments in MEMS pressure sensor technology, Introduced in the order below. Taiwan-based Pacific Microsystems Co., Ltd. has teamed up with Tsinghua University in Taiwan to develop a car TPMS sensor (thesis title: NOVEL TPMS SENSING CHIP WITH PRESSURE SENSOR EMBEDDED IN ACCELEROMETER). As shown in Figure 1, in order to reduce the chip size, the pressure sensor part is made in the mass of the piezoresistive acceleration sensor. Using the CavitySOI process combined with silicon / glass bonding, the composite sensor shows the performance specifications shown in Table 1.