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本文缩略语一览表(按ABC顺序) CAD: Computer aided design(计算机辅助设计) CMOS: Complementary metal axide Semiconductor(金属氧化半导体) FTC: flipped TAB Carrier(倒扣载带自动焊接体) HTB: heat transter block(传热板) ILB: inner lead bonding(内引线焊接) LCC: leabless chip-Carrir(无引线芯片载体) LCML: LSI oriented low energy current mobelogic(低电平电流型逻辑大规模集成电路) LSI: large scale integrateb circuit(大规模集成电路) MFLOPS: million floating point operatins per Second(每秒百万次浮点运算) OLB: outer lead bonding(外引线焊接)
Acronyms and Abbreviations List of Acronyms (By ABC) CAD: Computer aided design CMOS: Complementary metal axide Semiconductor FTC: flipped TAB Carrier HTB: heat transter block ( Heat transfer plate) ILB: inner lead bonding LCC: leabless chip-Carrir LCML: LSI oriented low energy current mobelogic LSI: large scale integrateb circuit MFLOPS: million floating point operatins per Second OLB: outer lead bonding (external lead bonding)