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如今,LED显示屏已在社会各个行业中广泛应用,LED显示屏器件封装经历了点阵模块、直插式、表贴三合一向COB发展,相应地LED显示屏也从单色、双色、多色到全彩的变化。LED显示屏器件朝着全彩化、小尺寸、低电流、高可靠性和低成本的不断发展,使得LED封装器件封装技术在越发重要的同时也面临着巨大的挑战。本文系统综述了LED显示屏器件封装的发展历程、目前现状以及未来的发展趋势。
Today, LED display has been widely used in various sectors of society, LED display package has experienced dot matrix modules, in-line, surface-mount three-in-one COB development, the corresponding LED display from monochrome, color, multi Color to full color changes. LED display devices towards full color, small size, low current, high reliability and low cost of continuous development, making the LED package device packaging technology is more and more important, but also faces a huge challenge. This article systematically reviews the LED display device package development process, the current status and future trends.