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钡钨阴极具有大发射,耐轰击,抗中毒等特点,多年来已广泛应用于各种微波器件中,特别是要求大电流密度的大功率管中。 实践中发现,渍制钡钨阴极靠浸渍的铝酸盐来固定多孔钨饼与钼筒是不够牢靠的,特别是当阴极尺寸较大,要求可靠性又较高的时候。为了解决这个问题,我们采用了电子束焊接工艺。 电子束焊接具有能量密度大、穿透深,精度高以及在真空中焊接不氧化,不渗杂的优
Barium tungsten cathode has a large launch, resistance to bombardment, anti-poisoning and other characteristics, over the years has been widely used in a variety of microwave devices, in particular, require high-current density of high-power tube. In practice it has been found that it is not sufficient to secure a porous tungsten cake with a molybdenum can by a barium-tin-tungsten cathode impregnated with impregnated aluminate, especially when the cathode size is large and the reliability is high. In order to solve this problem, we use the electron beam welding process. Electron beam welding with energy density, deep penetration, high precision and vacuum welding is not oxidation, non-doped excellent