Solder相关论文
Down to the road of miniaturization and high power density, the heat dissipation is becoming one of the critical factors......
This paper studies the typical failure modes and failure mechanisms of non-wetting in an FCBGA(flip chip ball grid array......
SnCu solder is one of the most promising substitutes of SnPb solder, but its creep resistance is worse than that of the ......
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were ......
SnAgCu solder system with the addition of rare earth Ce,which has better thermo-mechanical properties compared to those ......
The microstructural evolution and interfacial reaction of the Au/Sn/Au/Sn/Au/Sn/Au couples were investigated during anne......
Very high cycle fatigue(VHCF) behaviors of bridge steel(Q345) welded joints were investigated using an ultrasonic fatigu......
Platinum group metals (PGM) include six elements, namely Pt, Pd, Rh, Ir, Os and Ru. PGM and their alloys are the importa......
本文利用高频感应加热方法,以YG8硬质合金作为焊接母材,对PCD刀具焊接用钎料进行钎焊实验。利用超景深显微镜、抗弯强度测试仪等仪......
Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoi
该文从挂篮荷载计算、施工流程、支座及临时固结施工、挂篮安装及试验、合拢段施工、模板制作安装、钢筋安装、混凝土的浇筑及养生......
采用真空-充氩熔炼V-B系列钎料,并通过球磨技术制成焊料粉末.实验表明:V-B系列钎料的真空钎焊性能优良;V-B系列块状钎料瞬间熔化并......
用荧光厚度分析仪、X光透视、扫描电子显微镜/能谱仪及切片分析等手段研究了不同镀镍壳体的烧结性能。结果表明,不同镀镍类型的镀......
Investigation on Aging-induced Softening of Eutectic Microstructure in SnBi/Cu Interconnect by Nanoi
Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal a......
